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Conventional PCB Board Inspection Standards
gesptechnologypcbJuly 6, 2017 Blog 0 Comment195views

What is the PCBA board inspection standard?

Let’s take a look at the standard shortcomings of quality testing..

  1. Serious shortcomings(expressed in CR): Were enough to the human body or machine damage or endanger the failures of life safety, such as security does not match/burn machine / electric shock and so on.
  2. The main shortcomings (in terms of MA): may cause damage to the product, functional, or material due to the impact of product life shortcomings.
  3. The secondary shortcomings (in MI): does not affect the product features and service life, some of the appearance of the defective problems, and the organization of the slight adverse or differences in the shortcomings.

PCBA Board Inspection Conditions

  1. To prevent the pollution of components or components, must have EOS / ESD full protection of gloves or finger sets and wear electrostatic ring operation, the light source for the white fluorescent light, light intensity must be 100Lux above, 10 seconds visible.
  2. Test methods: the test items will be placed at about 40cm from the eyes, up and down around 45o, to visual or three times magnifying glass.
  3. The test criteria: (according to QS9000 C = 0 AQL = 0.4% sampling level of sampling; if the customer has special requirements, according to customer acceptance criteria)
  4. Sampling plan: MIL-STD-105E LEVEL Ⅱ normal single sampling
  5. Determine the standard: serious shortcomings (CR) AQL 0%
  6. The main shortcomings (MA) AQL 0.4%
  7. Secondary disadvantage (MI) AQL 0.65%

SMT Patch Shop PCBA Board Test Project Standards

  1. SMT parts solder empty joint welding
  2. SMT parts solder joint cold welding: with a toothpick light parts of the pin if the tip is cold welding
  3. SMT parts (solder joints) short circuit (Tin bridge)
  4. SMT parts missing parts
  5. SMT parts wrong pieces
  6. SMT parts polarity anti or wrong caused by burning or explosion
  7. SMT parts more pieces
  8. SMT parts flip: text face down
  9. SMT parts side: chip components length ≤ 3mm, width ≤ 1.5mm no more than five (MI)
  10. SMT parts Tombstone: chip components at the end of the tilt
  11. SMT parts foot offset: side offset is less than or equal to the width of the solderable side
  12. SMT parts float height: the bottom of the component and the substrate distance <1mm
  13. SMT parts feet high Alice: tilt the height of the foot is greater than the thickness of the foot
  14. SMT parts heel is not flat feet do not eat Tin
  15. SMT parts can not be identified (printing fuzzy)
  16. SMT parts feet or bulk oxidation
  17. SMT parts body damage: capacitance damage (MA); resistance damage is less than the component width or thickness of the 1/4 (MI); IC damage in either direction length <1.5mm (MI), exposed internal material (MA)
  18. SMT parts use non-designated suppliers: according to BOM, ECN
  19. SMT parts solder tip tin tip: tin tip height greater than the part body height
  20. SMT parts of eating too little Tin: the minimum solder joint height is less than the thickness of the solder plus the end of the solderable height of 25% or solder thickness plus 0.5mm, of which the smaller (MA)
  21. SMT parts of overeating Tin: the maximum solder joint height beyond the pad or climb to the metal coating end cap can be welded to the top of the solder receptacle, solder contact element body (MA)
  22. Solder ball/tin slag: more than 5 per 600mm2 solder ball or solder splash (0.13mm or less) for (MA)
  23. The solder joint pinhole/blowhole: a solder joint has an (inclusive) above (MI)
  24. The crystallization of the phenomenon: the PCB board surface, welding terminals or terminals around the white residue, the metal surface has a white crystal
  25. The board unclean: long arm distance 30 seconds can not be found in the unclean for acceptance
  26. Poor dispensing: viscose is located in the area to be welded, to reduce the width of the solder to be welded more than 50%
  27. PCB copper foil Alice skin
  28. PCB exposed copper: line (Goldfinger) exposed copper width greater than 0.5mm for (MA)
  29. PCB scratch: scratch no substrate
  30. PCB focus yellow: PCB after reflow furnace or after the repair of roasted yellow and PCB color is different
  31. PCB bending: any direction of bending in the deformation between each 300mm more than 1mm (300: 1) for the (MA)
  32. PCB internal separation (bubble): the bubble generation and stratification area does not exceed the plating hole or the distance between the internal conductor 25% (MI); in the plating hole or between the internal wire blistering (MA)
  33. PCB contamination foreign body: conductive (MA); non-conductive (MI)
  34. PCB version error: according to BOM, ECN
  35. Gold finger dip tin: sticky tin position on the board side of the 80% (MA)

DIP After the Workshop PCBA Board Test Project Standards

  1. DIP parts solder joint empty welding
  2. DIP parts solder joint cold welding: with a toothpick light parts of the pin if the toggle is cold welding
  3. DIP parts (solder joints) short circuit (Tin bridge)
  4. DIP parts missing parts:
  5. DIP part line length: Φ ≤ 0.8mm → line length is less than or equal to 1.5mm Φ> 0.8mm → line length is less than or equal to 2.0mm special cut foot except
  6. DIP parts wrong pieces:
  7. DIP parts Polarity anti or wrong caused by burning or explosion
  8. DIP Part feet Deformation: Pin bent over 50% of pin thickness
  9. DIP parts Floating or Alice: Refer to IPC-A-610E, according to assembly according to special circumstances
  10. DIP parts solder tip tin tip: tin tip height greater than 1.5mm
  11. DIP parts can not be identified: (printing blurred)
  12. DIP parts feet or bulk oxidation
  13. DIP parts of the body damage: the surface of the component damage, but did not reveal the internal components of the metal material
  14. DIP parts use of non-designated suppliers: according to BOM, ECN
  15. PTH hole vertical filling and peripheral wetting: at least 75% vertical filling, pin and hole wall at least 270o wetting
  16. Solder ball/tin slag: more than 5 per 600mm2 solder ball or solder splash (0.13mm or less) for (MA)
  17. Solder joint pinhole/blowhole: a solder joint has three (inclusive) or more (MI)
  18. the crystallization phenomenon: the PCB board surface, welding terminals or terminals around the white residue, the metal surface with white crystals
  19. The circuit boards unclean: arm long distance 30 seconds can not be found in the unclean for acceptance
  20. Poor dispensing: viscose is located in the area to be welded, to reduce the width of the solder to be welded more than 50%
  21. Copper foil Alice skin:
  22. PCB exposed copper: line (gold finger) exposed copper width greater than 0.5mm for (MA)
  23. PCB scratch: scratch no substrate
  24. PCB coke yellow: PCB after reflow furnace or after repair with roasted yellow and PCB color is different
  25. PCB bending: any direction of bending in the deformation between each 300mm more than 1mm (300: 1) for the (MA)
  26. PCB internal separation (bubble): the bubble generation and stratification area does not exceed the plating hole or the distance between the internal conductor 25% (MI); between the plating hole or internal wire blistering (MA)
  27. PCB contamination foreign body: conductive (MA); non-conductive (MI)
  28. PCB version error: according to BOM, ECN
  29. gold finger dip tin: sticky tin position on the board side count 80% (MA)

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