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Five Trends of PCB Technology
gesptechnologypcb四月 22, 2020 Blog 0 Comment326views

Electronic equipment requires high performance, high speed and thin and short. And as a multidisciplinary industry – PC is the most critical high-end electronic equipment technology. PCB products, whether the rigid, flexible, rigid-flexible combination of multi-layer board, as well as IC packaging substrate for the module substrate for high-end electronic equipment to make a significant contribution. The PCB industry plays an important role in electronic interconnect technology. Memories of China PCB through 50 years of hard history. Today it has been in the history of the development of the world to write a glorious page. China’s PCB output in 2006 nearly 13 billion US dollars

The 21st century, mankind has entered a high information society. In the information industry, PCB is an indispensable important pillar.

Electronic equipment requires high performance, high speed and thin and short, and as a multidisciplinary industry – PC is the most critical high-end electronic equipment technology. PCB products, whether the rigid, flexible, rigid-flexible combination of multi-layer board, as well as IC packaging substrate for the module substrate for high-end electronic equipment to make a significant contribution. The PCB industry plays an important role in electronic interconnect technology.

Memories of China PCB through 50 years of hard history, today it has been in the history of the development of the world to write a glorious page. 2006 China PCB output value of nearly 13 billion US dollars, known as the world’s largest PCB production power.

On the current development trend of PCB technology. I have the following views:

First, along the high-density interconnect technology (HDI) road development

Because HDI embodies the most advanced technology of contemporary PCB, it brings fine lead and tiny aperture to PCB. HDI Multilayer Board Applications Terminal Electronics – Mobile Phones (Mobile Phones) is an example of HDI’s cutting edge development technology. In the mobile phone PCB board, fine wire (50μm ~ 75μm / 50μm ~ 75μm, wire width/spacing) has become the mainstream. In addition to the conductive layer, thin plate thickness. Conductive graphics refinement, bringing electronic equipment high density, high performance The

More than 20 years HDI to promote the development of mobile phones, led information processing and control the basic frequency function of the LSI and CSP chip (package), packaging template substrate development, also promote the development of PCB, so along with the HDI road development.

Second, the component embedded technology has a strong vitality

In the inner layer of the PCB to form a semiconductor device (name as active components), electronic components (name as passive components) or passive components function “component embedded PCB” has begun mass production, component embedding technology is PCB function integrated circuit Huge change. But to develop must solve the simulation design methods, production technology, and inspection quality, reliability assurance is a top priority.

We have to include the design, equipment, testing, simulation. Including the system to increase investment in resources to maintain a strong vitality.

Third, PCB material development to a higher level

Whether it is rigid PCB or flexible PCB material, with the global lead-free electronic products, the requirements must make these materials more heat-resistant, so the new high Tg, small thermal expansion coefficient, dielectric constant, dielectric loss tangent fine material Continue to emerge.

Fourth, photoelectric PCB prospects

It uses the optical layer and circuit layer to transmit signals, this new technology is the key to manufacturing optical layer (optical waveguide layer). It is an organic polymer, the use of lithography, laser ablation, reactive ion etching and other methods to form. At present the technology in Japan, the United States has been industrialized.

Fifth, the manufacturing process to be updated, advanced equipment to be introduced

  • Manufacturing Process: HDI PCB manufacturing is mature and tends to improve, with the development of PCB technology, although the commonly used method of reducing the production method is still dominant, the addition method and semi-additive method and other low-cost process began to rise. Using nanotechnology to make hole metallization simultaneously forms the PCB conductive pattern of the new manufacturing flexible plate process. High reliability, high-quality printing method, inkjet PCB process.
  • Advanced Equipment: Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices. Uniform plating equipment. Production components embedded (passive active components) manufacturing and installation of equipment and facilities.

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